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05- International Journal of Thin Film Science and Technology
An International Journal
               
 
 
 
 
 
 
 
 
 
 
 
 

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Volumes > Vol. 6 > No. 3

 
   

Models of Electric Transport in Bilayer Ni/Cu And in a Tri-layer Ni/Pd/Cu Thin Films

PP: 113-116
doi:10.18576/ijtfst/060303
Author(s)
M. K. Loudjani, C. Sella,
Abstract
In this work we propose to measure the resistivities of bilayer Ni/Cu and tri-layer Ni/Pd/Cu thin films. We will compare the experimental resistivity of bilayer Ni/Cu or a tri-layerNi/Pd/Cu to the resistivity calculated from the resistivities of the simple layers of copper, nickel and palladium. We show that in the presence of aconstantelectric fieldparallel to the interface of Ni/Cu, electronic transport in bilayer, is equivalent to that of two distinct layers (of Ni and Cu) laid out in two parallel circuits, and that of a tri-layer Ni/Pd/Cu is equivalent to that the electronic transport of three distinct layers (of Ni, Pd and Cu) laid out in three parallel circuits.

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